elcompcb.com

امکانات ساخت برد مدار چاپی

PCB General Capability
Number of Layer
1-50 Layer
Maximum processing area
680 x 1000 mm
Min board Thickness
2 Layer - 0.3mm(12mil)
4 Layer - 0.4mm(16mil)
6 Layer - 0.8mm(32mil)
8 Layer - 1.0mm(40mil)
10 Layer - 1.1mm(44mil)
12 Layer - 1.3mm(52mil)
14 Layer - 1.5mm(59mil)
16 Layer - 1.6mm(63mil)
18 Layer - 1.8mm(71mil)
Finished board thickness tolerance
Thickness<0.8mm, Tolerance:+/-0.08mm
0.8mm≤Thickness≤6.5mm,Tolerance+/-10%
Twisting and bending
≤0.75% Min0.5%
Range of TG
130-215°C
Impedance tolerance
+/-10%, Min+/-5%
Hi-Pot Test
Max4000V/10MA/60S
Surface treatment
HASL , With Lead , HASL Free Lead
Flash Gold , Immersion Gold
Immersion Silver , Immersion Tin
Gold Finger , Osp
PCB Cu thickness +plating
Out layer Cu thickness
1-6 OZ
Inner layer Cu thickness
0.5-4 OZ
Cu thickness of PTH
average>=20um
Min.>=18um
HASL with lead
Tin 63% Lead37%
HASL free lead
Surface thickness>=0075um
Thickness in the hole>=5um
Flash Gold
Ni thickness:3-5um (120u"-160u")
Gold thickness:0.025-0.075um (1u"-3u")
Immersion Gold
Ni thickness:3-5um (120u"-160u")
 Gold thickness:0.025-0.15um (1u"-6u")
Immersion Tin
 Tin thickness:0.8-1.2um(32u"-48u")
Immersion silver
Ag thickness:0.15um-0.75um (6u"-30u")
Gold Finger
Ni thickness:3-5um(120u"-160u")
Gold thickness:0.025-1.51um(1u"-60u")
PCB Pattern limit Capability
Min width
0.1mm (4 mil)
Min trace
 0.1mm (4 mil)
Min width of ring (inner layer)
0.1mm (4 mil)
Min width of ring (out layer)
0.1mm (4 mil)
Min solder bridge
0.1mm (4 mil)
Min height of legend
0.7mm (28mil)
Min width of legend
0.15mm (6 mil)
PCB Holes processing Capability
Final hole size
Min 0.2mm
Drilling hole size
0.20~6.5mm
Drilling tolerance
+/-0.05mm
Final hole size tolerance (PTH)
φ0.20~1.60mm+/-0.075mm
φ1.60~6.30mm: +/-0.10mm
Final hole size tolerance (NPTH)
φ0.20~1.60mm+/-0.05mm
φ1.60~6.50mm: +/-0.05mm
Drilling strip hole
Length /width 2:1
Min strip hole width 0.65mm
Length & width tolerance +/-0.05mm
board thickness/hole size
≤ 10:1
PCB Cover thickness Capability
Solder mask Color
green, matte green,yellow,blue,red,black,matte black
Solder mask thickness
Surface line≥10um
Surface line corner≥6um
Surface board 10-25um
Solder mask bridge width: HOZ≥0.1mm IOZ≥0.12mm
Legend Color
White, yellow, black
Min height of legend
0.70mm (28mil)
Min width of legend
0.15mm (6 mil)
Blue Gel thickness
0.2-1.5mm
Blue Gel tolerance
+/-0.15mm
Carbon print Thickness
5-25um
Carbon print Min space
0.25mm
Carbon print impedance
200Ω